List of Electronics Standards

• ASTM F15 – Standard Specification for Iron-Nickel-Cobalt Sealing Alloy
• ASTM F996 – Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current–Voltage Characteristics
• ASTM F96 – Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
• ASTM F97 – Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration (Withdrawn 2008)
• ASTM F979 – Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)
• ASTM F980 – Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
• ASTM F83 – Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters
• ASTM F85 – Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes
• ASTM F816 – Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)
• ASTM F78 – Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)
• ASTM F7 – Standard Specification for Aluminum Oxide Powder
• ASTM F798 – Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)
• ASTM F769 – Standard Test Method for Measuring Transistor and Diode Leakage Currents (Withdrawn 2006)
• ASTM F773M – Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric)
• ASTM F76 – Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors
• ASTM F72 – Standard Specification for Gold Wire for Semiconductor Lead Bonding
• ASTM F73 – Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
• ASTM F744M – Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
• ASTM F676 – Standard Test Method for Measuring Unsaturated TTL Sink Current (Withdrawn 2009)
• ASTM F692 – Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)
• ASTM F615M – Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric) (Withdrawn 2022)
• ASTM F616M – Standard Test Method for Measuring MOSFET Drain Leakage Current (Metric) (Withdrawn 2009)
• ASTM F617 – Standard Test Method for Measuring MOSFET Linear Threshold Voltage (Withdrawn 2006)
• ASTM F528 – Standard Test Method of Measurement of Common-Emitter D-C Current Gain of Junction Transistors (Withdrawn 2011)
• ASTM F508 – Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
• ASTM F487 – Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
• ASTM F448 – Standard Test Method for Measuring Steady-State Primary Photocurrent
• ASTM F458 – Standard Practice for Nondestructive Pull Testing of Wire Bonds
• ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
• ASTM F4 – Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)
• ASTM F44 – Standard Specification for Metallized Surfaces on Ceramic
• ASTM F418 – Standard Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements (Withdrawn 2008)
• ASTM F375 – Standard Specification for Integrated Circuit Lead Frame Material
• ASTM F390 – Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array (Withdrawn 2020)
• ASTM F357 – Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
• ASTM F358 – Standard Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers (Withdrawn 2008)
• ASTM F364 – Standard Specification for Molybdenum Flattened Wire for Electron Tubes
• ASTM F3290 – Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
• ASTM F3291 – Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor
• ASTM F3192 – Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
• ASTM F3152 – Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates Using Dry or Wet Abrasive Medium
• ASTM F3166 – Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
• ASTM F3139 – Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
• ASTM F3147 – Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
• ASTM F31 – Standard Specification for Nickel-Chromium-Iron Sealing Alloys
• ASTM F30 – Standard Specification for Iron-Nickel Sealing Alloys
• ASTM F3078 – Standard Test Method for Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF)
• ASTM F3 – Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)
• ASTM F29 – Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
• ASTM F2964 – Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent Lamp or Other Diffuse Lighting Device
• ASTM F2980 – Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence (XRF)
• ASTM F2931 – Standard Guide for Analytical Testing of Substances of Very High Concern in Materials and Products
• ASTM F289 – Standard Specification for Molybdenum Wire and Rod for Electronic Applications
• ASTM F290 – Standard Specification for Round Wire for Winding Electron Tube Grid Laterals
• ASTM F288 – Standard Specification for Tungsten Wire for Electron Devices and Lamps
• ASTM F2853 – Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams
• ASTM F2865 – Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch
• ASTM F2866 – Standard Test Method for Flammability of a Membrane Switch in Defined Assembly
• ASTM F2771 – Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions
• ASTM F2749 – Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Printed Electronic Device
• ASTM F2750 – Standard Test Method for Determining the Effects of Bending a Membrane Switch or Printed Electronic Device
• ASTM F2725 – Standard Guide for European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange
• ASTM F269 – Standard Test Method for Sag of Tungsten Wire
• ASTM F2617 – Standard Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry
• ASTM F2592 – Standard Test Method for Measuring the Force-Displacement of a Membrane Switch
• ASTM F256 – Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
• ASTM F2576 – Standard Terminology Relating to Declarable Substances in Materials
• ASTM F2577 – Standard Guide for Compositional Evaluation of Declarable Substances and Substances of Concern for Materials in Products
• ASTM F2405 – Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2020)
• ASTM F2357 – Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool “RCA” Abrader (Withdrawn 2017)
• ASTM F2358 – Standard Guide for Measuring Characteristics of Sapphire Substrates
• ASTM F2359 – Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source
• ASTM F2360 – Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source
• ASTM F2187 – Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
• ASTM F2188 – Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
• ASTM F219 – Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
• ASTM F2113 – Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
• ASTM F2114 – Standard Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch (Withdrawn 2009)
• ASTM F2112 – Standard Terminology for Membrane Switches
• ASTM F2072 – Standard Test Method for Hosedown of a Membrane Switch
• ASTM F2073 – Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch
• ASTM F2086 – Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)
• ASTM F205 – Standard Test Method for Measuring Diameter of Fine Wire by Weighing
• ASTM F204 – Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire
• ASTM F1995 – Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
• ASTM F1996 – Standard Test Method for Silver Migration for Membrane Switch Circuitry
• ASTM F1997 – Standard Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch (Withdrawn 2008)
• ASTM F19 – Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals
• ASTM F1894 – Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness (Withdrawn 2020)
• ASTM F1895 – Standard Test Method for Submersion of a Membrane Switch
• ASTM F1896 – Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
• ASTM F1892 – Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
• ASTM F1893 – Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
• ASTM F1845 – Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer
• ASTM F1842 – Standard Test Method for Determining Ink or Coating Adhesion on Flexible Substrates for a Membrane Switch or Printed Electronic Device
• ASTM F1843 – Standard Practice for Sample Preparation of Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements
• ASTM F1844 – Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
• ASTM F180 – Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
• ASTM F18 – Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
• ASTM F1812 – Standard Test Method for Determining the Effect of an ESD Discharge on a Membrane Switch or Printed Electronic Device

12Next