{"version":"1.0","provider_name":"\u898f\u683c\u30de\u30b9\u30bf\u30fc","provider_url":"https:\/\/kikakumaster.com\/ja\/","author_name":"KikakuAdmin000","author_url":"https:\/\/kikakumaster.com\/ja\/author\/kikakuadmin000\/","title":"ASTM Book of Standards 10.04: Electronics; Declarable Substances In Materials; 3d Imaging Systems; Additive Manufacturing Technologies - \u898f\u683c\u30de\u30b9\u30bf\u30fc","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"x3LjgzTxaV\"><a href=\"https:\/\/kikakumaster.com\/ja\/astm-volume-10-04\/\">ASTM Book of Standards 10.04: Electronics; Declarable Substances In Materials; 3d Imaging Systems; Additive Manufacturing Technologies<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/kikakumaster.com\/ja\/astm-volume-10-04\/embed\/#?secret=x3LjgzTxaV\" width=\"600\" height=\"338\" title=\"&#8220;ASTM Book of Standards 10.04: Electronics; Declarable Substances In Materials; 3d Imaging Systems; Additive Manufacturing Technologies&#8221; &#8212; \u898f\u683c\u30de\u30b9\u30bf\u30fc\" data-secret=\"x3LjgzTxaV\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/kikakumaster.com\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>\n","description":"Volume 10.04 covers standards on electronics, including: \u2022 Innerlayer interconnections and bonding \u2022 Materials and processes for vacuum tubes \u2022 Electronic device characterization \u2022 Hermetic seals \u2022 Hybrid circuits and substrates \u2022 Microelectronic packaging \u2022 Leak testing \u2022 And more  This volume also includes the latest standards relating to: \u2022 Declarable substances in materials \u2022 3D imaging systems \u2022 Additive manufacturing technologies"}